The failure rate is 0.5% /1000h (Confidence level: 60%) based on JIS C 5003.
The prospective failure is not zero. The mainly failure modes are as follows.
2-1. Contingency failure
The most common failure mode is a short circuit. Mainly caused by the soldering or operating
temperature environment, along with heat stresses, electrical stresses or mechanical stresses
as follows.
(1) Applying voltage over the rated voltage.
(2) Applying reverse voltage
(3) Excessive mechanical stress
(4) Applying rush current by sudden charge or discharge out of the specification.
(a) The following phenomenon is seen when short-current is applied to OS-CON.
(1) When current is relatively low
(φ10: approx 1A or less, φ8: approx 0.5A or less, φ6.3: approx 0.2A or less)
OS-CON becomes heated, but no effects are visible even when the current is continously carried.
(2) When the short circuit currents exceed the mentioned value above.
After internal temperature increase, sealing rubber may be turned over.
In some cases, odorous gas may be is produced.
(b) In case a short circuit occurs, ensure safety by fully considering the followings.
(1) If odorous gas is released, turn off the main power of the equipment.
In this case, keep your face and hands away from the area.
(2) Though it depends on the conditions, it takes seconds to minutes before odorant gas generates.
Protective circuit should operate in this period.
(3) If the gas comes info eyes, rinse immediately. If the gas is inhaled, gargle immediately.
(4) Do not lick the electrolyte. If the electrolyte touches skin, wash it off with soap immediately.
(5) OS-CON contains combustible substances. In case a large current continues to flow after a short circuit, in
the worst case, the shorted-out section may ignite. For safety, install a redundant circuit or a protective circuit, etc.
2-2. Wear-out failure (lifetime)
When lifetime span exceeded the specified guarantee time of Endurance and Damp heat, electrolyte might
insulate and cause electric characteristic changed. This is called an open circuit.
The electric characteristics of capacitance and ESR may possibly change within the specified range in
specifications when it is used under the condition of the rated voltage,
electric and mechanical performance. Please note it when design.
(a) OS-CON leakage current may become larger as the following conditions.
(1) Soldering
(2) When voltage is not applied: high temperature no-load test, high temperature and high humidity no-load test,
rapidly changing temperature test, etc.
(b) Avoid the use of OS-CON in the following type of circuits because leakage current may increase.
(1) High-impedance circuits
(2) Coupling circuits
(3) Time constant circuits
(4) Other circuits that are significantly affected by leakage current
※ If you plan to use 2 or more OS-CONs in a series connection, please contact us before use
Other precautions
OS-CON
leakage current restoration characteristics
16V/10μF (16V DC applied)
OS-CON
leakage current restoration characteristics
10V/33μF (Ambient temperature:65℃)
(Measured voltage:10V)
※To make the recovery of LC values
easy to show, samples that LC values
have been increased on purpose are
used in the test.
105℃
(Hrs.)
1,000
100
10
1
0.1 1 10 100 1,000
60℃ 20℃
(Hrs.)
1,000
100
10
1
0.1 1 10 100 1,000
5V applied
8V applied
10V applied
Mechanical stress may cause OS-CON leakage current increased.
In such a case, leakage current will gradually decrease by applying voltage within
the category voltage and the upper limit of category temperature.
Then, self-healing speed of leakage current is faster when it is near to
the upper limit of category temperature and the category voltage.
Allowance of a large rush current to flow due to rapid charge and discharge may result in short circuit or large
leakage current. The protection circuit, to maintain high reliability, is recommended when rush current to flow
to OS-CON is in the following cases.
(a) Products which 10 times of allowable ripple current is less than 10A:It is when 10A or over of rush
current is applied
(b) Products which 10 times of allowable ripple current is 10A or over:It is when rush current, which the
figure is over 10 times of allowable ripple current, is applied.
(a) When the lead terminal for radial lead type must be processed because the lead pitch and the PCB
holes in spacing do not match, process it without any stresses to OS-CON before soldering.
(b) Solder without any excessive stresses to OS-CON itself.
(c) When an OS-CON has been soldered once and needs to be removed, remove it after the solder has been
completely melted.
(d) Do not let the tip of the soldering iron touch the OS-CON itself.
(a) Do not apply flow soldering to OS-CON SMD type.
(b) Do not solder OS-CON itself by submerging it in melted solder. Solder the opposite side that the OS-CON is mounted on.
(c) Note that flux does not adhere to anywhere expect the lead terminal.
(d) Note that other components do not fall over and touch the OS-CON when soldering.
(a) Do not apply reflow soldering to OS-CON Radial Lead type.
(b) Please contact us for setting VPS condition.
(a) Do not tilt, bend or twist OS-CON.
(b) Do not move the PCB with holding OS-CON itself.
(c) Do not hit the OS-CON with objects.
(d) When stacking PCBs, make sure that the OS-CON does not touch other PCBs or components.
Do not subject the OS-CON to excessive stress as follows.
(a) Use immersion or ultrasonic waves to clean within 2 minutes.
(b) The temperature of the cleaning fluid should be less than 60℃.
(c) Watch the contamination of the detergent such as conductivity, pH, specific gravity, water content, etc.
(d) Do not store the OS-CON in a location subject to gases from the cleaning fluid or in an airtight container
after cleaning.
(e) Dry the PCB or OS-CON with hot air that should be less than the jpper category temperature.
(f ) Please note that Indication may disappear when rubbing print side after washing depending on a cleaner.
(g) Please contact us for details about detergents, cleaning methods and detergents
other than those listed above.
(a) Select the appropriate covering and sealant materials for OS-CONs. In particular, make sure the fixative,
coating and thinner do not contain acetone.
(b) Before applying a fixative or coating, completely remove any flux residue and foreign matter from the
area where the board and OS-CON will be jointed together.
(c) Allow any detergent to dry before applying a fixative or coating.
(d) Please contact us for fixative and coating heat curing conditions.
Check the following items before washing PC board with these detergents: high quality alcohol-based
cleaning fluid such as Pine-α ST-100S, clean thru 750H, 750L, 710M, 750K or Techno Care FRW 14
through 17 or detergents including substitute freon as AK-225AES or IPA.
Open the bags just before mouting and use up all products once opened,
For keeping a good solderability, store the OS-CON as follows.
SMD type※1 Within 30 days from opening
(packaged with carrier tape)
Radial
lead type
Bag packing product
Taping product Within 7 days from opening
Within 24 months after shipment
Within 30 months after shipment
Within 24 months after shipment
Before unsealing After unsealing
※1 The JEDEC J-STD-020 standard is not applicable.
Reflow soldering
Handling after soldering
Cleaning PCB
Fixatives and coating materials
Storage conditions
(a) Select the appropriate covering and sealant materials for OS-CONs. In particular, make sure the fixative,
coating and thinner do not contain acetone.
(b) Before applying a fixative or coating, completely remove any flux residue and foreign matter from the
area where the board and OS-CON will be jointed together.
(c) Allow any detergent to dry before applying a fixative or coating.
(d) Please contact us for fixative and coating heat curing conditions.
Check the following items before washing PC board with these detergents: high quality alcohol-based
cleaning fluid such as Pine-α ST-100S, clean thru 750H, 750L, 710M, 750K or Techno Care FRW 14
through 17 or detergents including substitute freon as AK-225AES or IPA.
Open the bags just before mouting and use up all products once opened,
For keeping a good solderability, store the OS-CON as follows.
SMD type※1 Within 30 days from opening
(packaged with carrier tape)
Radial
lead type
Bag packing product
Taping product Within 7 days from opening
Within 24 months after shipment
Within 30 months after shipment
Within 24 months after shipment
Before unsealing After unsealing
※1 The JEDEC J-STD-020 standard is not applicable.
Reflow soldering
Handling after soldering
Cleaning PCB
Fixatives and coating materials
Storage conditions
10 Capacitor insulation
. Be sure to completely separate the case, negative lead terminal, positive lead terminal and PC board patterns with each other due to the following reasons.
(a) Insulation in the marking sleeve and the laminate resin is not guaranteed. (b) The space between the case and the negative electrode terminal is not insulated and has some resistance.
